Recommended Professional's Choice - LOWEST ONLINE PRICE - New smoothing compound technology - Bostik SL C955 ADVANCED is a two-part, high-performance smoothing compound (sold as one unit to be mixed together) that doesn’t require intensive subfloor preparation – saving you both time and money! With exceptional flow characteristics, it can be applied directly to most common substrates without priming due to its high adhesion and low shrinkage properties, including old adhesive residues, ceramic tiles, Bostik damp proof membranes, flooring grade plywood, and resin flooring. It’s unaffected by moisture, meaning it can be used over damp subfloors prior to the application of a damp proof membrane, and can be applied from 2mm to 30mm in a single application when bulked out with a suitable aggregate. It has a fast walk-on time of two hours, while floor coverings can be laid in as little as four hours under good ambient drying conditions. The smoothing compound is specially formulated to be used in conjunction with waterborne underfloor heating systems and can also be used to encapsulate electric cable type heating.
We would recommend using Bostik Primer A526 with this product for the best results.
Suitable for use over adhesive residues, ceramic tiles, plywood, resin flooring, damp subfloor and damp proof membranes
Suitable for underfloor heating
Application should be in temperature of +5°C to +27°C
Free* delivery on x2 or more packs
Available for express dispatch or same day click & collect
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